Česky
DeutschTflex 3160 228x228x4 mm ; A15336-01
LAIRD: Tflex 3160 228x228x4 mm Thermal Gap Filler, A15336-01
Price (net of VAT) / ks
28,9570 EUR
Quantity rabats |
|
|---|---|
| 1 - 49 ks | 28,9570 EUR net of VAT/ks |
| 50 - 99 ks | 27,3910 EUR net of VAT/ks |
| More than 99 ks | 24,7830 EUR net of VAT/ks |
Tflex 3160 228x228x4 mm Thermal Gap Filler, A15336-01
Product Description
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” components
• Thermal conductivity of 1.2 W/mK
• Low compression set enables the pad to be reused many times
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
Product Description
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” components
• Thermal conductivity of 1.2 W/mK
• Low compression set enables the pad to be reused many times
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
| Store name | Availability | Of which reserved | Price (net of VAT) | |
|---|---|---|---|---|
| ATD hlavní sklad | 247 | 0 | 28,9570 EUR | |
| ATD - sklad vzorky | 0 | 0 | EUR |
